SMTA华东高科技会议—iNEMI低温焊接技术工作坊

4月24日，上海世博展览馆9号会议室

工业界正在尝试探索采用低温焊料组装手机、平板电脑和移动电脑等消费电子产品。将锡银铜（SAC）焊膏的峰值回流温度从当前240℃以上的水平降低，由此带来经济性、环境和技术上的优势。低温焊接还为新兴市场如超移动计算、可穿戴设备和物联网（IOT）提供了一种潜在的解决方案，以减少更小、更薄和高度集成的电子设备的组装中的动态翘曲。将回流峰值温度降低到200℃以下可以降低能耗，提高表面贴装良率，但同时也需要新的焊接材料具备良好的可靠性和工艺性。

iNEMI技术工作坊鼓励与会者在研讨中互动，讨论和分享有关低温焊料的信息和经验，例如：

·         低温焊料材料和技术的新发展和未来计划

·         iNEMI基于锡铋的低温焊接工艺和可靠性项目报告

·         提高产量和质量所需的研究创新

·         未来产品和技术的要求对焊锡材料和工艺的影响

·         低温焊锡材料的工艺性、可靠性和失效分析

·         讨论新的合作项目机会，推动低温焊锡技术在行业中的开发和部署

本次专项研讨会的目标人群是致力于开发和鉴定新型低温焊料解决方案的电子制造商、研究人员和供应商，您将有机会和他们会面并分享和讨论。

议程计划

报名注册

早鸟票（3月31日前）：760元人民币，

常规票（3月31至4月18日前）：900元人民币

*登记费包括会议报告的材料、午餐券、咖啡/茶和水。

人民币（支付）：

账户名：澳龙信息科技（上海）有限公司

账号：   310066865018010020955

收款行：交通银行上海市分行张江支行

开票事宜请联系：sammulw@infosalons.com.cn

iNEMI Low-Temperature Solder Workshop – SMTA China East Conference

Join iNEMI at NEPCON China in Shanghai to discuss new developments and future plans for low-temperature solder materials and techniques.

iNEMI Low-Temperature Soldering Workshop

Held at 2019 SMTA China East Conference

Shanghai World Expo Exhibition and Convention Center

Wednesday, April 24 / 9:00-16:45 / Meeting room #9

Industry is exploring the adoption of low-temperature solder for the assembly of consumer electronic products, such as cell phones, tablets and mobile computers. Lowering peak reflow temperature from the current 240oC+ level for SnAgCu (SAC) solder paste has economic, environmental and technical benefits. Low-temperature soldering also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages for emerging markets such as ultra-mobile computing, wearable devices and Internet of Things (IoT). Lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields, but it also requires a new class of reliable soldering materials and processes.

This iNEMI workshop will provide an interactive forum where participants can discuss and share information about low-temperature solder such as:

·         New developments and future plans for low-temperature solder materials and techniques

·         Results from iNEMI’s BiSn-based Low-Temperature Soldering Process and Reliability project

·         Innovations required to improve yield and quality

·         Impact of future product and technology requirements on solder materials and processes

·         Processability, reliability and failure mechanisms of low-temperature solder materials

·         Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry

This workshop gives you the opportunity to meet and network with leading electronics manufacturers, researchers and suppliers who are working to develop and qualify new low-temperature solder solutions.

Registration

Early bird registration is USD$100 (CNY 760) until March 31, after which the fee is $120 (CNY 900). The registration fee covers workshop presentations, lunch coupon, coffee/tea breaks and water.

Click here for additional details, including agenda and registration.
https://community.inemi.org/ev_calendar_day.asp?date=4/24/2019&eventid=257

Preliminary Agenda